Hwang, Lih-Tyng | Horng, Tzyy-Sheng Jason

3D IC and RF SiPs : Advanced Stacking and Planar Solutions for 5G Mobility

2018 - John Wiley et Sons Ltd.

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Hwang, Lih-Tyng | Horng, Tzyy-Sheng Jason

3D IC and RF SiPs : Advanced Stacking and Planar Solutions for 5G Mobility

2018 - John Wiley et Sons Ltd.

1000073 characters.

Informazioni
ISBN: 9781119289661

Permalink: http://digital.casalini.it/9781119289661

COLLANA

IEEE Press
MATERIE
- Fisica applicata
- Mechanical Engineering and Machinery

EUR 123,36

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