Advanced Micro-Device Engineering III

Volume is indexed by Thomson Reuters CPCI-S (WoS).The aim of this volume is to accelerate the exchange of information on the best practices for CAD, CAM, Manufacturing, Mechanical Engineering, Modeling and Simulation, etc. Engineers and scientists in academia, industry and government here address the most innovative research and development work, including technical challenges and social and economic issues, and discuss their ideas, results, work-in-progress and experience concerning all aspects of Computer-Aided Design, Manufacturing, Modeling and Simulation. [Publisher's text].

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