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Franke, Jörg | Pojtinger, Andreas | Birkicht, Albert | Kuhn, Thomas

11th International Congress Molded Interconnect Devices - Scientific Proceedings : Scientific Proceedings

2014 - Trans Tech Publications

130 p.

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg - Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. [Publisher's text].

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