Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-in-Package

• Información

  ISBN: 9781119793892

  Permalink: http://digital.casalini.it/9781119793892

  COLECCIÓN

  IEEE Press
  

  MATERIAS

  • Ingeniería militar y náutica
  • Military Engineering, Air Forces, Military Astronautics