Kröhnert, Steffen | Keser, Beth

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-in-Package

2021 - John Wiley et Sons Ltd.

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Kröhnert, Steffen | Keser, Beth

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces : High Performance Compute and System-in-Package

2021 - John Wiley et Sons Ltd.

529349 characters.

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ISBN: 9781119793892

Permalink: http://digital.casalini.it/9781119793892

SERIES

IEEE Press
DISCIPLINES
- Military and nautical engineering
- Military Engineering, Air Forces, Military Astronautics

EUR 125.71

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