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Hwang, Lih-Tyng | Horng, Tzyy-Sheng Jason

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

2018 - IEEE press

464 p.

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools [Publisher's Text]

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