Lead-free Soldering Process Development and Reliability

Covering the majortopics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect forprocess, quality,failure analysisand reliability engineersin production industries,this reference will help practitioners address issues inresearch, development andproduction. Among other topics, the book addresses: · Developments in process engineering(SMT, Wave, Rework, Paste Technology) · Lowtemperature,hightemperature andhighreliabilityalloys · Intermetallic compounds · PCB surface finishesandlaminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book'sexplanations ofhigh-temperature, low-temperature, andhigh-reliabilitylead-free alloysin terms of process and reliability implicationsare invaluable to working engineers. Lead-free Soldering takes a

forward-looking approach, with an eye towards developments likely to impact the industryin the comingyears. These will include the introduction of lead-free requirementsin high-reliability electronics products in themedical, automotive, and defense industries.The book provides practitioners in theseand other segments of theindustrywith guidelinesand informationtohelpcomplywith these requirements. [Publisher's Text]

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